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Low-power High-performance 32-bit RISC-V Microcontroller on 65-nm Silicon-On-Thin-BOX (SOTB)

Publications from the university repository - Tue, 10/13/2020 - 08:45

Hoang, Trong Thuc and Duran, Ckristian and Nguyen, Khai Duy and Dang, Tuan Kiet and Nguyen, Quang Nhu Quynh and Than, Phuc Hong and Tran, Xuan Tu and Le, Duc Hung and Tsukamoto, Akira and Suzaki, Kuniyasu and Pham, Cong Kha (2020) Low-power High-performance 32-bit RISC-V Microcontroller on 65-nm Silicon-On-Thin-BOX (SOTB). IEICE Electronics Express, VV . ISSN 1349-2543

A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs

Publications from the university repository - Mon, 09/07/2020 - 08:18

Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.

A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems

Publications from the university repository - Mon, 09/07/2020 - 08:16

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems. IEEE Access . (In Press)

Thermal distribution and reliability prediction for 3D Networks-on-Chip

Publications from the university repository - Mon, 07/13/2020 - 10:10

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering, 36 (1). pp. 65-77. ISSN 0866-8612

TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems

Publications from the university repository - Fri, 07/10/2020 - 14:57

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (3). pp. 672-685. ISSN 1063-8210