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Publications from the university repository


Syndicate content VNU-UET Repository: No conditions. Results ordered -Date Deposited.
1. This is a multi-institution subject-based repository. 2. Subject Specialities: (a) Multidisciplinary (b) Science General (c) Mathematics and Statistics (d) Physics and Astronomy (e) Technology General (f) Computers and IT (g) Electrical and Electronic Engineering (h) Mechanical Engineering and Materials 3. The repository is restricted to: (a) Journal articles (b) Bibliographic references (c) Conference and workshop papers (d) Theses and dissertations (e) Unpublished reports and working papers (f) Books, chapters and sections (g) Multimedia and audio-visual materials (h) Software (i) Patents (j) Other special item types 4. Deposited items may include: (a) working drafts (b) submitted versions (as sent to journals for peer-review) (c) accepted versions (author's final peer-reviewed drafts) (d) published versions (publisher-created files) 5. Items are individually tagged with: (a) their version type and date. (b) their peer-review status. (c) their publication status. 6. Principal Languages: English; Vietnamese; French
Updated: 5 weeks 3 days ago

Low-power High-performance 32-bit RISC-V Microcontroller on 65-nm Silicon-On-Thin-BOX (SOTB)

Tue, 10/13/2020 - 08:45

Hoang, Trong Thuc and Duran, Ckristian and Nguyen, Khai Duy and Dang, Tuan Kiet and Nguyen, Quang Nhu Quynh and Than, Phuc Hong and Tran, Xuan Tu and Le, Duc Hung and Tsukamoto, Akira and Suzaki, Kuniyasu and Pham, Cong Kha (2020) Low-power High-performance 32-bit RISC-V Microcontroller on 65-nm Silicon-On-Thin-BOX (SOTB). IEICE Electronics Express, VV . ISSN 1349-2543

A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs

Mon, 09/07/2020 - 08:18

Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.

A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems

Mon, 09/07/2020 - 08:16

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems. IEEE Access . (In Press)

Thermal distribution and reliability prediction for 3D Networks-on-Chip

Mon, 07/13/2020 - 10:10

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering, 36 (1). pp. 65-77. ISSN 0866-8612

TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems

Fri, 07/10/2020 - 14:57

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (3). pp. 672-685. ISSN 1063-8210